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Abstract

A method and apparatus for dry cleaning a semiconductor wafer storage and transport pod. After the pod is located with respect to the cleaning chamber and opened to expose the interior surfaces of the pod to the cleaning chamber, the pod is conditioned in preparation for the cleaning process. The conditioning of the pod includes purging the pod and cleaning chamber with an ionized nitrogen gas to rid the pod and cleaning chamber of airborne contaminants and to neutralize static electrical charges on the pod surfaces. The conditioning process further includes heating the pod surfaces to prevent condensation of moisture and organic contaminants thereon. After the conditioning process, the pod is cleaned with a dry aerosol sprayed onto the pod surfaces. The aerosol spray is comprised of an ionized carbon dioxide/nitrogen (CO.sub.2 /N.sub.2) gas and fine particles of CO.sub.2. The dry cleaning apparatus further includes a circulation subsystem for circulating a fluid through the pod and cleaning chamber to remove airborne particulate, such as those dislodged from the pod surfaces by the CO.sub.2 /N.sub.2 aerosol spray. A filter provided within the path of the circulating fluid removes particulates from the circulating fluid.

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First Claim