Membrane probing of circuits
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United States of America Patent
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-
Dec 8, 1998
Issued Date -
N/A
app pub date -
Jul 3, 1996
filing date -
Sep 9, 1994
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
First and second bumps electrically connected at first and second positions along a conductive run borne by a flexible substrate are respectively oriented for contact with a pad of a die under test and a pad of a tester. A probe frame is bonded to the substrate between connector frames bonded at opposite ends of the substrate. Alternatively, a pair of bumps exposed on the same surface of a flexible substrate are electrically connected at different positions along a conductive run. One of the bumps is oriented for contact with a pad of a die under test, and the other is in contact with a pad on a surface of a printed circuit board directed away from the die. The pad of the printed circuit board is provided for electrical connection to a tester.
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