Electronic circuit chip package
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United States of America Patent
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-
Dec 8, 1998
Grant Date -
N/A
app pub date -
Dec 16, 1996
filing date -
Dec 16, 1996
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A package for an electronic component includes a metal base plate and a body of an insulating material, such as glass or ceramic, on and bonded to a surface of the base plate. The body is formed of a plurality of layers of the insulating material stacked and bonded to each other and has at least one opening extending therethrough to the base plate. Strips of a conductive material, such as a metal, are on the surface of various layers of the body. An electronic component is mounted in the opening in the body and has terminals which are electrically connected to the conductive strips on the body, preferably by wires. Vias of a conductive material may extend through some of the layers of the body to connect the conductive strips to terminals on the surface of the body. A cover plate of an insulating material may extend over the body and the opening therein to enclose the electronic component in the body.
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