Importance

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Abstract

Semiconductor chip assemblies are fabricated by providing a wafer having a plurality of semiconductor chips and providing a sheet separate from the wafer having a plurality of dielectric elements. Each chip has a plurality of contacts and each dielectric element has a plurality of terminal formed thereon. The sheet and the wafer are then assembled so that the terminals on the dielectric elements face away from the wafer and so that each chip is associated with a dielectric element. The contacts on each chip are connected to the terminals on a dielectric element associated with the chip. The individual dialectic elements are then severed from the sheet and the individual chips are severed from the wafer after the assembling and connecting step to provide subassemblies, each subassembly including a chip and the dielectric element associated with the chip. In another embodiment, a plurality of individual dielectric elements separate from one another and separate from a wafer are provided.

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First Claim