Apparatus for solvent bonding non-porous materials to automatically create variable bond charteristics
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United States of America Patent
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-
Dec 15, 1998
Issued Date -
N/A
app pub date -
Aug 1, 1997
filing date -
Jan 26, 1990
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An apparatus which creates a pre-engineered solvent bond is disclosed which acts to self-optimize the characteristics of the resultant solvent bond. These characteristics can thus be chosen by the part designer with confidence that inherent variations in the assembly process will not unduly impact the resultant bond. The design establishes a specific volume through integral tabs or removable shims within which solvent acts to precisely dissolve material so that the predetermined bond characteristics are automatically created without reliance upon assembler technique.
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