Sputtering device and method for reactive for reactive sputtering
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United States of America Patent
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Dec 15, 1998
Grant Date -
N/A
app pub date -
Apr 25, 1995
filing date -
Apr 25, 1995
priority date (Note) -
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Abstract
A method for reactive sputter coating in a chamber in which large substrates to be coated are transported past one or more coating stations. The stations are comprised of at least one sputtering target and at least one adjacent plasma generator. In the practice of this invention the sputtering and reaction zones within the chamber are indistinguishable.
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