Method of manufacturing an array of surface mount contacts
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United States of America Patent
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Dec 22, 1998
Issued Date -
N/A
app pub date -
Apr 10, 1996
filing date -
Jan 31, 1995
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An electronic socket adapter includes an insulative carrier and an array of a plurality of surface mount contacts carried on the base. The pins may be floatably mounted on the carrier. A plurality of relatively large openings are formed in the carrier between adjacent contacts in the array. The openings provide improved heat flow in the region of the surface mount portions of the contacts and also provide for visualization of the surface mount portions of the contacts during and after soldering.
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