Polishing pad conditioning system and method
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United States of America Patent
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Dec 22, 1998
Grant Date -
N/A
app pub date -
Aug 5, 1997
filing date -
Aug 15, 1996
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A system and method for conditioning a polishing pad.sup.12 in a chemical-mechanical polishing process for polishing a semiconductor wafer. The conditioning system includes a conditioning device 20 into which a plurality of removable inserts 24 are inserted. The inserts each have a tip 26 comprising a conditioning material. During operation, the plurality of insert tips 26 contact the polishing pad 12 to condition the polishing pad 12, thereby enhancing the uniformity of wafers polished by the polishing pad and reducing damage to polished wafers.
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