Face-up semiconductor chip assembly
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United States of America Patent
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Dec 22, 1998
Issued Date -
N/A
app pub date -
Jul 6, 1998
filing date -
Sep 24, 1990
priority date (Note) -
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Abstract
A semiconductor assembly having contacts on a peripheral region of the top surface of a chip and a backing element overlying the bottom surface of the chip. The backing element has terminals such that at least some of the terminals overlie the bottom surface of the chip. Leads including bonding wires extending alongside the edges of the chip connect the contacts and the terminals. The terminals of the assembly are movable with respect to the chip.
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