Method of coating a sputter cathode with a layer of material to be applied to a substrate by sputtering
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United States of America Patent
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Dec 29, 1998
Issued Date -
N/A
app pub date -
Feb 4, 1997
filing date -
Jul 15, 1992
priority date (Note) -
Expired
status (Latency Note)
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Abstract
This invention is relating to a sputter cathode (1) with a layer of material that is applied to a substrate by sputtering, wherein this layer (3) contains low electrical conductivity particles (3a) of which a certain quantity are at least coated by a film (3b) of electrically conductive material, or which form an aggregate with a conductive material, so as to give this layer (3) sufficient electrical conductivity to be able to be applied to the substrate by means of sputtering.
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