Laser machining of a workpiece
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United States of America Patent
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Dec 29, 1998
Grant Date -
N/A
app pub date -
Mar 21, 1997
filing date -
Mar 21, 1997
priority date (Note) -
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status (Latency Note)
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Abstract
A laser machining (including marking) method that employs a diode laser pumped solid state laser is controlled by a computer that contains a program for the interaction of the laser beam with a workpiece. The pumping of the laser is synchronised with the action of the beam in a series of active machining periods alternating with inactive non-machining periods. In order to avoid overheating of the active element, the duty cycle of these periods is maintained below a chosen value and no active period is allowed to exceed a selected percentage of the thermal time constant of the active element.
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