IC-processed microneedles
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United States of America Patent
Stats
-
Jan 5, 1999
Issued Date -
N/A
app pub date -
Jan 7, 1997
filing date -
Jun 6, 1994
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method of fabricating a microstructure is disclosed. The method includes providing a substrate for forming an interface region and an elongated portion extending away from the interface region. A patterned, non-planar etchable structure is formed on one side of the elongated portion of the substrate. An unetchable membrane layer is deposited atop the etchable structure. At least one etching hole is formed in the membrane layer. The etchable structure is etched by placing an etchant into the etching hole to form a cavity underneath the membrane layer, thereby producing a shaft.
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Family
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Cited Art Landscape
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