Substrate holder and reaction apparatus
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United States of America Patent
Stats
-
Jan 12, 1999
Grant Date -
N/A
app pub date -
Apr 4, 1995
filing date -
Apr 6, 1994
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
The present invention relates to a reaction apparatus for receiving a reaction gas and for heating a substrate so as to form a film such as an insulating film on the substrate or for etching, with reduced power consumption for heating the substrate. The apparatus can change a substrate temperature within a short period of time, and maintains throughput while reducing labor and cost for maintenance. The apparatus includes a substrate holder (12) with a base of an insulating material in which an electrode (22) and a heater (23) for heating the held substrate (20) are contained. The apparatus also includes a processing chamber (7) enclosed by a chamber wall (7a).
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