Method and system for measuring object features
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United States of America Patent
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Jan 12, 1999
Grant Date -
N/A
app pub date -
Jul 12, 1996
filing date -
Jul 12, 1996
priority date (Note) -
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Abstract
A system is provided that simultaneously gathers three-dimensional and two-dimensional data for use in inspecting objects such as chip carriers for defects. Specifically, a source laser beam is directed to an object and forms a spot at the point of impingement at a known X-Y position on the object. The laser beam is reflected at the spot and light reflected off-axially with respect to the source laser beam is detected by two position sensing detectors (PSDs). Simultaneous to detecting off-axially reflected light, retro-reflected light (i.e., the light reflected approximately co-axial with the source laser) is detected by a photo diode array.
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