Method of manufacturing an electronic component
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United States of America Patent
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-
Jan 19, 1999
Grant Date -
N/A
app pub date -
Sep 30, 1996
filing date -
Sep 30, 1996
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An electronic component includes a substrate (11) having a device surface (13) and opposite ends (14, 15) adjacent to the device surface (13), an electronic device (16) supported by the device surface (13), and an interconnect substrate (30) overlying a first end (14) of the substrate (11) and electrically coupled to the electronic device (16). The electronic component can be manufactured by inserting the second end (15) of the substrate (11) into one of a plurality of holes (23) in a carrier (20) wherein the device surface (13) and the carrier (20) form an angle greater than approximately five degrees.
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