Method of coating a conductive substance on a transparent electrode formed on a substrate and method of mounting a semiconductor device or film substrate on the substrate

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United States of America Patent

PATENT NO 5860212
SERIAL NO

08408319

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Abstract

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A method of coating a conductive substance on a transparent electrode disposed on a substrate comprises disposing a resin containing the conductive substance over the surface of the substrate, and rubbing and pressing the resin over the surface of the substrate with a pressing shaft to coat a layer of the resin on the transparent electrode. A method of mounting a semiconductor device or the film substrate on the substrate having the transparent electrode coated with the resin layer containing the conductive substance comprises connecting a terminal portion of the semiconductor device or film substrate to the transparent electrode through the resin layer.

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Patent Owner(s)

Patent OwnerAddress
SEIKO INSTRUMENTS INC8 NAKASE 1-CHOME MIHAMA-KU CHIBA-SHI CHIBA 2618507 ?2618507

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Matsuhira, Tsutomu Chiba, JP 26 656

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