Lead bending machine for electronic components

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 5860455
SERIAL NO

08940950

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A general-purpose lead bending machine for electronic components that is capable of bending leads of various types of electronic components without a need of a great variety of benders. The machine includes a lead holding device for holding the distal end of a lead of an electronic component. A first driving mechanism causes the lead holding device to move along a first axis of travel. A second driving mechanism causes the lead holding device to move along a second axis of travel perpendicularly intersecting the first axis of travel. A control device controls the first driving mechanism and the second driving mechanism such that the lead holding device holding the lead of the electronic component moves along an approximately circular arc-shaped locus, thereby bending the lead of the electronic component.

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Patent Owner(s)

Patent OwnerAddress
ISHII TOOL & ENGINEERING CORPORATION1-3 HIGASHI-OHMICHI 2-CHOME OHITA-SHI OHITA 870

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ishii, Mitoshi Ohita, JP 10 84

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