Substrate for transferring bumps and method of use
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United States of America Patent
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-
Jan 19, 1999
Grant Date -
N/A
app pub date -
May 31, 1996
filing date -
May 31, 1996
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A first pattern of bumps and a second pattern of bumps are formed on a substrate (10) with bumps (14,15). During a transfer process, only the bumps (14) of the first pattern of bumps are transferred to pad extensions (20) of a device (17). The bumps (15) of the second pattern of bumps are not affected by this process and can be later transferred to a second device.
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