Importance

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Abstract

A semiconductor processing chamber includes a substrate support member on which a substrate and a clamp ring are aligned during processing in the chamber. To align the substrate on the support member, a frustoconical substrate alignment member extends about the perimeter of the substrate receiving surface of the support member to capture a substrate received in the chamber and center the substrate on the upper surface of the support member. The alignment member includes an alignment face thereon, which urges a substrate into alignment with the substrate receiving face of the support member as the substrate is deposited on the support member. To clamp the substrate in proper alignment on the support member and flatten any warpage in the substrate, a clamp ring alignment member is provided which aligns and supports a clamp ring on a substrate without causing significant shadowing of the substrate. The clamp ring is vertically and laterally aligned relative to the support member and substrate centered thereon. The clamp ring alignment member is preferably a plurality of adjustable alignment pins positioned in the outer perimeter of the support member.

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First Claim