Process for manufacturing metal ball electrodes for a semiconductor device
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United States of America Patent
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Jan 19, 1999
Grant Date -
N/A
app pub date -
Jun 6, 1994
filing date -
Jun 6, 1994
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Process for manufacturing arrays of metal balls for interconnect testing and/or interconnect bonding of microelectronic devices and the like with substrates are formed by securing metal balls in predetermined patterns of apertures in an insulating membrane or film. The pattern of apertures corresponds with the pattern of metal interconnect pads on a microelectronic device or the like and the corresponding pattern of interconnect pads on the substrate. The metal ball arrays may be used for testing and/or may be heated and reflowed to bond the microelectronic device to the substrate.
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