Stacked chip assembly
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United States of America Patent
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Jan 19, 1999
Grant Date -
N/A
app pub date -
Aug 29, 1996
filing date -
Aug 30, 1995
priority date (Note) -
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Abstract
An assembly of semiconductor chips has the chips vertically stacked above one another. Interposers extending between adjacent chips have compliant layers to accommodate thermal expansion of the chips. Desirably, the interposers have metallic plates to conduct heat from the interior of the stack.
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