Integrated circuit device having an opening exposing the integrated circuit die and related methods
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Jan 19, 1999
Issued Date -
N/A
app pub date -
Jun 27, 1996
filing date -
Jan 26, 1996
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
An integrated circuit device, such as a fingerprint sensing device, includes an integrated circuit die, a body of encapsulating material surrounding the integrated circuit die and having an opening therein exposing a portion of the integrated circuit die, and an electrically conductive member or frame being mounted to the body of encapsulating material adjacent the opening therein. The electrically conductive member may preferably be positioned so as to define at least a portion of a frame for the opening in the body of encapsulating material. The electrically conductive member may be adhesively secured to the integrated circuit die. Accordingly, the adhesive and electrically conductive member may serve as a seal to the interface between the body of encapsulating material and the die. The electrically conductive member may define a frame that surrounds a body of removable material during an intermediate stage in manufacturing. More particularly, the body of removable material and its frame may be positioned on the integrated circuit die while plastic is injection molded to encapsulate the asembly.
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