Lead conditioning system
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United States of America Patent
Stats
-
Jan 26, 1999
Grant Date -
N/A
app pub date -
Jul 1, 1997
filing date -
Jul 1, 1997
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A system for conditioning the leads of a semiconductor device. The system includes a base having at least one anvil surface configured to form the leads to a predetermined shape, and at least one forming arm mounted to the base. An actuator is movable relative to the base to move the forming arm from a first position, with the forming arm spaced from the leads, to a second position, with the forming arm urging the leads against the anvil surface to form the leads to a predetermined configuration.
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