Apparatus and method for forming thin film
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United States of America Patent
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Jan 26, 1999
Issued Date -
N/A
app pub date -
Jan 5, 1996
filing date -
Nov 27, 1992
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A forming apparatus of a thin film, includes a processing chamber where a predetermined process is carried out on a surface of a supplied substrate, and a feeding device, which is provided in the processing chamber, for feeding material to form an organic molecular layer including silicon or germanium on the surface of the substrate. A forming method of a thin film, includes steps of forming a thin film on a surface of a supplied substrate in a processing chamber, and feeding material for forming an organic molecular layer including silicon or germanium on the formed thin film on the surface of the substrate through a feeding device in the processing chamber, and then forming the organic molecular layer on the surface of the substrate.
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