Flux for soldering electronic components on circuit substrates, and mounted or unmounted circuit substrate
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United States of America Patent
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Jan 26, 1999
Grant Date -
N/A
app pub date -
Feb 27, 1996
filing date -
Mar 10, 1995
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
The invention provides a soldering flux for mounting circuit substrates, which is free from any organic solvent attributable to air pollution and dispenses with any washing step. The soldering flux is obtained by dissolving a rosin modified by an unsaturated organic acid according to the Diels-Alder reaction in an aqueous solvent. A volatile basic agent may further be contained in the flux.
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