Device for cathode sputtering
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United States of America Patent
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Jan 26, 1999
Grant Date -
N/A
app pub date -
Apr 11, 1997
filing date -
Apr 13, 1996
priority date (Note) -
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status (Latency Note)
Importance
Abstract
A device for cathode sputtering for producing coatings on a substrate 27 by means of a sputtering cathode, which device can be introduced into a vacuum chamber and has magnets or ring magnets 9, 13 concentrically arranged in respect to the center axis 44 of the sputtering cathode, pole shoes 14 and a target 8. The target has a front surface 41 with at least a surface portion which is inclined with respect to the back surface 40 of the target. In the area of the back surface 40 of the target at least one second, outer ring magnet 42 with a larger diameter is provided in addition to the inner ring magnets 9, 13.
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