Method and apparatus for adjustment in mold thickness of a complex mold clamping system

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United States of America Patent

PATENT NO 5863474
SERIAL NO

08788267

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Abstract

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A method and system of controlling a screw engaging position adjuster provided in a complex mold clamping system. A theoretical deviation of a screw engaging position is theoretically calculated on the basis of a distance by which a movable die has been moved from an origin set for a mold thickness adjustment in clamping process. A measured deviation of the screw engaging position is measured from a distance between a mold clamping cylinder and a movable platen in clamping process. The screw engaging position adjuster is so controlled that a difference between the theoretical deviation and the measuring deviation is within an allowable deviation having previously been set.

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Patent Owner(s)

Patent OwnerAddress
TOSHIBA MACHINE CO LTD2-11 4-CHOME GINZA CHUO-KU TOKYO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ito, Katsuo Shizuoka-ken, JP 31 380
Sasaki, Kiyoshi Shizuoka-ken, JP 27 407

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