High performance flexible laminate

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United States of America Patent

PATENT NO 5863666
SERIAL NO

08911357

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Abstract

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This invention relates to an improved high performance flexible laminate, comprising: a layer of electrodeposited copper foil overlying a layer of a flexible polymeric material, said copper foil being characterized by an ultimate tensile strength at 23.degree. C. of at least about 60,000 psi, a loss of ultimate tensile strength at 23.degree. C. of no more than about 15% after being annealed at 180.degree. C. for 30 minutes, an average grain size of up to about 1 micron, and a fatigue performance characterized by at least about 5000 cycles to failure when the strain amplitude is about 0.05% to about 0.2%. In one embodiment, the copper foil is electrodeposited using an electrolyte solution characterized by a free chloride ion concentration of up to about 4 ppm and an organic additive concentration of at least about 0.3 ppm.

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Patent Owner(s)

Patent OwnerAddress
NIKKO MATERIALS USA INC125 NORTH PRICE ROAD CHANDLER AS 85224

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Clouser, Sidney J Chardon, OH 21 254
Merchant, Harish D Hinckley, OH 4 65

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