Thermosetting phenolic resin composition
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United States of America Patent
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Jan 26, 1999
Grant Date -
N/A
app pub date -
Jul 23, 1996
filing date -
Jul 23, 1996
priority date (Note) -
Expired
status (Latency Note)
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Abstract
This invention relates to a resin composition capable of being thermally cured having both a long pot life at low temperatures and a fast curing rate at higher temperatures containing a mixture of (a) a phenol-formaldehyde resole resin, and (b) a latent curing agent selected from a particular class of nitrogen-containing acidic phosphorus compounds made from either phosphoric acid or phosphorous acid.
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