Leadless ceramic chip carrier crosstalk suppression apparatus
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United States of America Patent
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Jan 26, 1999
Grant Date -
N/A
app pub date -
May 16, 1996
filing date -
May 16, 1996
priority date (Note) -
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status (Latency Note)
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Abstract
A leadless ceramic chip carrier useful in surface mounting of SAW devices includes electrically conductive vias and metalization between input and output bond pads for improved crosstalk suppression between input and output device connections. A protrusion extending from a top layer of a multilayer ceramic carrier provides additional electrical contact to a package seal brazed thereto. The vias are positioned between input and output bond pads and connect the metalized protrusion to package ground pads through contact with multiple metalized layers of the package for enhancing the electrical connection between the package Kovar seal ring and customer accessed ground pads. For further suppression of crosstalk, bond pads within the package for connection to the SAW device are spaced at a greater distance from each other than their corresponding pads on the package bottom surface thus maintaining an optimum spacing for package connection to printed circuit board pads for minimizing thermal mismatch effects.
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