Method of forming solder bumps
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United States of America Patent
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-
Feb 2, 1999
Grant Date -
N/A
app pub date -
May 6, 1997
filing date -
May 8, 1996
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
An Al electrode pad and a photoresist pattern having an opening portion on the Al electrode pad on a semiconductor substrate on which a surface protective film has been formed are formed. Then, a barrier metal layer is formed on the whole substrate surface, and a resist film and the barrier metal layer on the resist film are removed by lift-off, thus forming a solder bump foundation layer. Furthermore, an adhesive tape is stuck to the substrate surface and then the adhesive tape is peeled off, thereby to perform a residue removing process for removing resist film residues and useless barrier metal residues other than the solder bump foundation layer. With this, it is possible to further remove residues that have remained on the substrate surface without being lifted off and caused a defective device with an adhesive tape, thus making it possible to form a solder bump of high reliability in flip chip bonding. In this way, there is provided a method of forming such a solder bump that is capable of flip chip bonding on a semiconductor device with high reliability.
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