Micromachined probe card having compliant contact members for testing semiconductor wafers
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Feb 9, 1999
Grant Date -
N/A
app pub date -
Apr 1, 1996
filing date -
Apr 1, 1996
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A probe card for testing semiconductor dice contained on a wafer and a method for fabricating the probe card are provided. The probe card includes a substrate preferably formed of silicon, and having a pattern of contact members corresponding to a pattern of test pads on the wafer. Each contact member is formed integrally with the substrate and includes a projection formed as an elongated blade adapted to penetrate into a corresponding test pad to a limited penetration depth. In addition, a cavity and a flexible membrane are formed in the substrate subjacent to the contact members to permit flexure of the contact members. Fluid or gas pressure can be introduced into the cavity through flow passages formed in the substrate.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully