Chip connection structure having diret through-hole connections through adhesive film and wiring substrate
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United States of America Patent
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-
Feb 9, 1999
Grant Date -
N/A
app pub date -
Dec 14, 1995
filing date -
Dec 15, 1994
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A structure for connecting an integrated circuit chip to a wiring substrate which implements high-density packaging, high-density connection, high-speed signal transmission, and low cost. An integrated circuit is connected to a wiring substrate by means of flip-chip die bonding using an adhesive film. A direct through-hole connection is formed directly below a connecting pad so as to pass through the adhesive film and the wiring substrate. This direct through-hole connection directly connects the connecting pad to the wire. As a result of reduced area and thickness of the chip, the chip is mounted in high density, and high-density inputs and outputs are implemented by means of minute two-dimensional connections. Short wire connections directly connected to the chip permit high speed signal transmission, and high reliability is ensured by the dispersion of stress. Low-cost packaging can be effected by simple processes and facilities.
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