Attachment apparatus for an implantable medical device employing ultrasonic energy
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United States of America Patent
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-
Feb 16, 1999
Grant Date -
N/A
app pub date -
Aug 1, 1997
filing date -
Aug 1, 1997
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A method and apparatus for attaching a pre-formed header module to a hermetically sealed enclosure of an implantable medical device are described. A plurality of upstanding tabs attached to the hermetically sealed enclosure extend into a plurality of corresponding tab channels formed in the header module. The upstanding tabs are inserted into the respective tab channels during seating of the module and enclosure attachment surfaces and effect an initial alignment of the header module with the hermetically sealed enclosure. Each attachment tab has a retention feature such as a recess formed on or in the tab that is designed to receive molten thermoplastic material when ultrasonic energy is applied in the region of the tab channel.
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