Flexible continuous cathode contact circuit for electrolytic plating of C4, TAB microbumps, and ultra large scale interconnects
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Feb 16, 1999
Issued Date -
N/A
app pub date -
Oct 17, 1997
filing date -
Sep 27, 1995
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A cathode contact device is provided for providing particle deposition from an anode source onto a target surface of a working piece. The working piece has a first electrically conductive continuous contact surrounding the target surface. The cathode contact device includes a second electrically conductive continuous contact adapted for frictionally contacting the first contact along a continuous path located on the first contact. The second contact further has an inner periphery defining an aperture for passing therethrough the particles onto the target surface. Additionally, the cathode contact device includes a circuit for electrically coupling the second contact to an electrical current supply.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully