Method for fabricating a thin film capacitor

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 5872040
SERIAL NO

08862994

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A method is provided for the manufacture of precision electronic components such as resistors, inductors, and capacitors on a polymer or ceramic surface. The electronic components can be deposited and trimmed to precise or matched values without having precise depositions of all of the pre-patterned materials. Thin film electronic components are deposited on a surface, parameter values are measured or estimated, a correction offset file is generated, and the components are trimmed using adaptive lithography to a very close tolerance. A computer program can be used to enable the adjustment of electronic components by techniques such as changing the physical length of an inductor coil or resistor lead, or by changing a capacitor plate area.

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First Claim

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Patent Owner(s)

Patent OwnerAddressTotal Patents
GENERAL ELECTRIC COMPANYSCHENECTADY, NY19473

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Balch, Ernest Wayne Ballston Spa, NY 24 804
Douglas, Leonard Richard Burnt Hills, NY 17 451
Downey, Evan Taylor Niskayuna, NY 3 100
Gdula, Michael Knox, NY 13 1597
Rose, James Wilson Guilderland, NY 56 1025
Wojnarowski, Robert John Ballston Lake, NY 48 2096

Cited Art Landscape

Patent Info (Count) # Cites Year
 
Other [Check patent profile for assignment information] (2)
* 4418474 Precision resistor fabrication employing tapped resistive elements 10 1980
* 5043295 Method of forming an IC chip with self-aligned thin film resistors 27 1989
 
MICRON TECHNOLOGY, INC. (1)
* 5496762 Highly resistive structures for integrated circuits and method of manufacturing the same 51 1994
 
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC (1)
* 5450263 Thin film inductors, inductor network and integration with other passive and active devices 62 1994
 
Chevron Research & Technology Company (1)
* 5370776 Electrochemical impedance spectroscopy method for evaluating corrosion inhibitor performance 15 1993
 
FAIRCHILD SEMICONDUCTOR CORPORATION (1)
* 5468672 Thin film resistor and method of fabrication 38 1993
 
MOTOROLA, INC. (1)
* 4470096 Multilayer, fully-trimmable, film-type capacitor and method of adjustment 35 1982
 
BUCKINGHAM CAPACITOR, INC. (1)
* 4570201 Capacitor 4 1984
 
SANYO ELECTRIC CO., LTD. (1)
* 5469131 Hybrid integrated circuit device 11 1993
 
TRW INC. (1)
* 5323138 Reliable thin film resistors for integrated circuit applications 20 1992
 
TERASAKI DENKI SANGYO KABUSHIKI KAISHA (1)
* 4388506 Circuit interrupter 7 1981
 
MURATA ELECTRONICS NORTH AMERICA, INC. (2)
* 5347423 Trimmable composite multilayer capacitor and method 27 1992
* 5345361 Shorted trimmable composite multilayer capacitor and method 19 1993
 
NATIONAL SEMICONDUCTOR CORPORATION (1)
* 5420063 Method of producing a resistor in an integrated circuit 33 1994
 
INTERSIL CORPORATION (1)
* 5547896 Direct etch for thin film resistor using a hard mask 35 1995
 
The United States of America as represented by the United States Department of Energy (1)
* 4801469 Process for obtaining multiple sheet resistances for thin film hybrid microcircuit resistors 18 1986
 
AGILENT TECHNOLOGIES, INC. (1)
* 5420515 Active circuit trimming with AC and DC response trims relative to a known response 15 1992
 
LOCKHEED MARTIN CORPORATION (2)
* 4783695 Multichip integrated circuit packaging configuration and method 364 1986
* 5353498 Method for fabricating an integrated circuit module 714 1993
 
NORTHROP GRUMMAN CORPORATION (1)
* 5266529 Focused ion beam for thin film resistor trim on aluminum nitride substrates 11 1991
 
World Properties, Inc. (1)
* 5358775 Fluoropolymeric electrical substrate material exhibiting low thermal coefficient of dielectric constant 60 1993
 
PROMOS TECHNOLOGIES INC. (1)
* 5084420 Resistor with side wall contact 9 1990
* Cited By Examiner

Patent Citation Ranking

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Patent Info (Count) # Cites Year
 
INTERNATIONAL BUSINESS MACHINES CORPORATION (1)
* 6268226 Reactive ion etch loading measurement technique 9 1999
 
Other [Check patent profile for assignment information] (2)
7200920 Method for the implementation of electronic components in via-holes of a multi-layer multi-chip module 1 2001
* 2004/0113,752 Method for the implementation of electronic components in via-holes of a multi-layer multi-chip module 2 2003
 
GENERAL ELECTRIC COMPANY (2)
7518236 Power circuit package and fabrication method 8 2005
* 2007/0090,464 Power circuit package and fabrication method 4 2005
 
U.S. BANK NATIONAL ASSOCIATION (1)
* 2005/0116,337 Method of making multichip wafer level packages and computing systems incorporating same 21 2005
 
Ultrasource, Inc. (9)
6761963 Integrated thin film capacitor/inductor/interconnect system and method 21 2001
6998696 Integrated thin film capacitor/inductor/interconnect system and method 8 2003
6890629 Integrated thin film capacitor/inductor/interconnect system and method 10 2003
7327582 Integrated thin film capacitor/inductor/interconnect system and method 6 2005
* 2005/0175,938 Integrated thin film capacitor/inductor/interconnect system and method 3 2005
7425877 Lange coupler system and method 1 2005
* 2005/0162,236 Lange coupler system and method 2 2005
7446388 Integrated thin film capacitor/inductor/interconnect system and method 6 2005
* 2006/0097,344 Integrated thin film capacitor/inductor/interconnect system and method 0 2005
 
MICRON TECHNOLOGY, INC. (1)
* 7485562 Method of making multichip wafer level packages and computing systems incorporating same 77 2005
 
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC (2)
6281564 Programmable integrated passive devices 4 1999
RE38550 Method for programmable integrated passive devices 0 2001
 
HARRIS CORPORATION (1)
* 2010/0024,210 Product Optimization Process for Embedded Passives 0 2007
 
CALIFORNIA MICRO DEVICES CORPORATION (1)
* 5998275 Method for programmable integrated passive devices 3 1997
* Cited By Examiner