Cluster tool layer thickness measurement apparatus

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United States of America Patent

PATENT NO 5872632
SERIAL NO

08594621

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A cluster tool layer thickness measurement apparatus is part of a reactor cluster that includes a plurality of substrate processing reactors arranged around a sealed chamber in which a robot is located. The cluster tool layer thickness measurement apparatus is also mounted on the sealed chamber. After a layer is deposited on a substrate in one of the reactors, the robot removes the substrate from the reaction chamber of the reactor and places the substrate directly in the cluster tool layer thickness measurement apparatus on a substrate support. A carriage assembly moves the substrate support and consequently the substrate under an optical thickness measurement assembly. Optical thickness measurement assembly generates a signal representative of the thickness of the layer at one point that is transmitted to a monitor computer. After the measurement is completed, the carriage assembly moves the substrate so that the thickness of a layer on the substrate is measured at each of a plurality of locations.

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Patent Owner(s)

Patent OwnerAddress
MOORE EPITAXIAL INC1905 N MACARTHUR DRIVE TRACY CA 95376

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Moore, Gary M Monte Sereno, CA 27 2004

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