Method of processing a wafer within a reaction chamber
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United States of America Patent
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Feb 23, 1999
Issued Date -
N/A
app pub date -
Oct 24, 1996
filing date -
Dec 2, 1992
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method of dechucking a workpiece from an electrostatic chuck. The method adaptively produces a dechucking voltage for canceling any unpredictable residual electrostatic fields between a workpiece and the electrostatic chuck. The method contains the steps of (a) applying a lifting force to the workpiece; (b) altering the chucking voltage; (c) measuring the lifting force; (d) comparing the measured lifting force to a threshold level; and, depending on the result of the comparison, either (e) maintaining the chucking voltage at its present level for a predefined period of time and physically dechucking the workpiece or (f) repeating steps (b), (c), (d) and (e).
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