Thermal stress relieving substrate
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United States of America Patent
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Feb 23, 1999
Grant Date -
N/A
app pub date -
Apr 21, 1997
filing date -
Apr 21, 1997
priority date (Note) -
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status (Latency Note)
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Abstract
A substrate for connecting one element having a first coefficient of thermal expansion to another element having a differing coefficient of thermal expansion that will alleviate interconnection problems due to thermal mismatch.
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