Polish process and slurry for planarization
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United States of America Patent
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Mar 2, 1999
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N/A
app pub date -
Jan 24, 1997
filing date -
Dec 9, 1996
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Abstract
A slurry containing abrasive particles and exhibiting normal stress effects. The slurry further contains non-polishing particles resulting in reduced polishing rate at recesses, while the abrasive particles maintain high polish rates at elevations. This leads to improved planarization.
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