Glass/Metal package and method for producing the same
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United States of America Patent
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Mar 2, 1999
Grant Date -
N/A
app pub date -
Aug 28, 1996
filing date -
Aug 28, 1996
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method of producing a glass/metal package where a glass portion of the package is built up around a provided leadframe (10) using applications of solderable and glass pastes (20) which are subsequently fired (30). The glass paste and leadframe are chosen to have similar coefficients of expansion and the leadframe is pretreated to degasify and control oxidation of the metal to promote glass adhesion to the leadframe and prevent microcracking at a glass/metal interface. A seal ring is applied to the glass paste (40) and a lid is attached to the seal ring (50). The package is used to provide an sealed inert internal environment for sensitive electronic components such as a piezoelectric element. The package may be configured for leaded or surface mounting (60).
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