Hybrid integrated circuit component

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 5877533
SERIAL NO

08812453

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A hybrid (composite) integrated circuit element comprises a substrate, a thin film type integrated circuit formed on a substrate through a thin film process, and a lamination type passive circuit element such as a capacitor, inductor, resitance and a combination thereof formed on the integrated circuit. During the firing of passive circuit element in a hydrogen atmosphere, the semiconductor layer which constitutes the integrated circuit is also heat annealed. Various substrates can be used as the substrate, for example, quartz, ceramic and a cheap semiconductor substrate which has not been treated with a mirror-grinding by the use of a glass layer.

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First Claim

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Patent Owner(s)

Patent OwnerAddressTotal Patents
Semiconductor Energy Laboratory Co., Ltd.KANAGAWA-KEN10848
TDK CORPORATIONTOKYO, JP3999

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Arai, Michio Tokyo, JP 141 3274
Nagano, Katsuto Kanagawa, JP 32 645
Sakamoto, Naoya Kanagawa, JP 67 1179
Yamauchi, Yukio Kanagawa, JP 76 1870

Cited Art Landscape

Patent Info (Count) # Cites Year
 
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Tokyo Shibaura Denki Kabushiki Kaisha (1)
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MICRON TECHNOLOGY, INC. (1)
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Compagnie d'Informatique Militaire, Spatiale et Aeronautique (1)
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Semiconductor Energy Laboratory Co., Ltd. (1)
* 5236850 Method of manufacturing a semiconductor film and a semiconductor device by sputtering in a hydrogen atmosphere and crystallizing 65 1991
 
TDK CORPORATION (1)
* 5643804 Method of manufacturing a hybrid integrated circuit component having a laminated body 78 1994
 
SAMSUNG ELECTRONICS CO., LTD. (1)
* 5135883 Process for producing a stacked capacitor of a dram cell 48 1990
 
LOCKHEED MARTIN CORPORATION (1)
* 5353498 Method for fabricating an integrated circuit module 714 1993
 
RCA CORPORATION A CORP. OF DE (1)
* 4714981 Cover for a semiconductor package 12 1986
 
RAYTHEON COMPANY (1)
* 4974039 Field effect transistor having an integrated capacitor 13 1989
* Cited By Examiner

Patent Citation Ranking

Forward Cite Landscape

Patent Info (Count) # Cites Year
 
CIRRUS LOGIC, INC. (1)
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Other [Check patent profile for assignment information] (6)
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* 2011/0068,887 ON-DIE MICRO-TRANSFORMER STRUCTURES WITH MAGNETIC MATERIALS 2 2010
 
SHARP KABUSHIKI KAISHA (5)
7769190 Audio signal processing circuit and a display device incorporating the same 0 2004
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INTEL CORPORATION (25)
6452247 Inductor for integrated circuit 32 1999
6856228 Integrated inductor 11 2001
6815220 Magnetic layer processing 15 2001
6891461 Integrated transformer 28 2001
6870456 Integrated transformer 27 2001
6789236 Integrated circuit device characterization 1 2002
6988307 Method of making an integrated inductor 4 2002
6856226 Integrated transformer 29 2002
6727154 Methods for fabricating inductor for integrated circuit or integrated circuit package 12 2002
7852185 On-die micro-transformer structures with magnetic materials 14 2003
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6943658 Integrated transformer 28 2003
7087976 Inductors for integrated circuits 2 2004
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6940147 Integrated inductor having magnetic layer 11 2004
7299537 Method of making an integrated inductor 2 2004
7119650 Integrated transformer 4 2004
7434306 Integrated transformer 25 2004
7332792 Magnetic layer processing 1 2005
7064646 Integrated inductor 4 2005
7327010 Inductors for integrated circuits 8 2006
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7791447 Integrated transformer 4 2008
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Ultrasource, Inc. (9)
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6998696 Integrated thin film capacitor/inductor/interconnect system and method 8 2003
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7425877 Lange coupler system and method 1 2005
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Semiconductor Energy Laboratory Co., Ltd. (42)
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7154148 Hybrid circuit and electronic device using same 3 2004
* 2004/0173,849 Hybrid circuit and electronic device using same 1 2004
8678958 Sports implement, amusement tool, and training tool 2 2005
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* 2006/0202,269 Wireless chip and electronic appliance having the same 33 2006
7619282 Hybrid circuit and electronic device using same 3 2006
* 2006/0138,427 Hybrid Circuit and Electronic Device Using Same 4 2006
8783577 Semiconductor device and electronic device having the same 0 2006
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8232621 Semiconductor device 1 2007
7714535 Power storage device 23 2007
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8044397 Semiconductor device having light emitting element, integrated circuit and adhesive layer 5 2008
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7852044 Power storage device 2 2010
* 2010/0213,893 POWER STORAGE DEVICE 4 2010
8441099 Wireless chip 4 2010
8054035 Power storage device including an antenna 1 2010
9799298 Liquid crystal display device and driving method thereof 0 2011
8441102 Semiconductor device having a capacitor 3 2011
9178182 Semiconductor device and method for manufacturing the same 0 2011
8692249 Power storage device 0 2011
8455954 Wireless chip and electronic appliance having the same 2 2012
9070563 Power storage device 0 2014
9640778 Semiconductor device and method for manufacturing the same 0 2015
 
RENESAS ELECTRONICS CORPORATION (9)
* 7276776 Semiconductor device 7 2004
* 2005/0145,987 Semiconductor device 14 2004
7557427 Semiconductor device 1 2007
7446390 Semiconductor device 9 2007
* 2008/0001,255 SEMICONDUCTOR DEVICE 4 2007
7915708 Semiconductor device 0 2009
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8237282 Semiconductor device 0 2011
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TEXAS INSTRUMENTS INCORPORATED (2)
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* 2004/0209,423 Methods for reducing capacitor dielectric absorption and voltage coefficient 5 2003
 
KABUSHIKI KAISHA TOSHIBA (2)
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6933205 Integrated circuit device and method of manufacturing the same 6 2002
 
Sychip Inc. (1)
* 2007/0065,964 Integrated passive devices 5 2005
 
OKI SEMICONDUCTOR CO., LTD. (1)
* 2006/0246,674 Passive element chip and manufacturing method thereof, and highly integrated module and manufacturing method thereof 3 2006
 
T-Mobile International AG & Co. KG (1)
* 2008/0057,928 DATA GROUP PAGING SERVICE 2 2007
* Cited By Examiner