Film carrier for fine-pitched and high density mounting and semiconductor device using same
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United States of America Patent
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-
Mar 2, 1999
Grant Date -
N/A
app pub date -
Aug 6, 1996
filing date -
Jun 12, 1995
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
In a film carrier with a conductive circuit formed, an opening is formed in a particular position relative to where the conductive path is to be formed. The opening is a through-hole, filled with a conductive material to form a conductive path. The conductive circuit has a concave face, provided according to certain formulae. The film carrier can cope with a fine-pitched and highly dense mounting, while prohibiting pulling out of the conductive path by an external force. The film carrier does not suffer from fallout of the conductive path, and has increased electrical connection reliability.
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