IC card and method of fabricating the same

United States of America Patent

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Mar 2, 1999
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N/A
app pub date
Apr 24, 1997
filing date
Apr 25, 1996

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Abstract

An IC card and a method of fabricating the same are provided in which the IC card substrate is formed of a blackened metal core plate to improve thermal, electrical and mechanical stability of the IC card.

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Patent Owner(s)

Patent Owner	Address
HANWHA TECHWIN CO LTD	GYEONGGI DO CITY OF SOUTH KOREA SEONGNAM GYEONGGI-DO

International Classification(s)

H05K:PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAIL....

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[Patents Count]

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Ryu, Jae-chul	Yongin, KR	10	83

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IC card and method of fabricating the same

Number of patents in Portfolio can not be more than 2000

United States of America Patent

08842211

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PATENT NO	5877941
SERIAL NO	08842211
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08842211

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First Claim

Family

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