Method of aperturing thin sheet materials
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United States of America Patent
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-
Mar 9, 1999
Issued Date -
N/A
app pub date -
Mar 20, 1998
filing date -
Sep 23, 1996
priority date (Note) -
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status (Latency Note)
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Abstract
A method of forming apertures generally greater than about 0.05 square millimeters in a thin sheet material. The thin sheet material includes a first side and a second side at least one side of the thin sheet material is substantially coated with an adhesive. The method comprises the steps of (a) placing the adhesive-coated thin sheet material on a patterned anvil having a pattern of raised areas wherein the height of the raised areas is equal to or less than the thickness of the thin sheet material and the adhesive; and (b) subjecting the thin sheet material to a sufficient amount of sonic vibrations to aperture the thin sheet material and the adhesive; and whereby the thin sheet material and the adhesive is apertured in a pattern generally the same as the pattern of raised areas on the patterned anvil.
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