System for circuit modules having a plurality of independently positionable probes
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United States of America Patent
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Mar 9, 1999
Grant Date -
N/A
app pub date -
Apr 16, 1996
filing date -
Apr 16, 1996
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A test system for multi-chip modules. Test points on the multi-chip modules are brought to the perimeter of the modules for easy access. The test points are grouped in arrays with an associated alignment post. The multi-chip module is probed with several independently positionable probes, each one of which can be independently aligned with one of the arrays of test points. Independent alignment of the test probes relaxes tolerances on the test points needed to ensure proper contact between the test pints and the probes. As a result, the test points can be made very small, thereby reducing the amount of the multi-chip module dedicated for testing. In the preferred embodiment, the probes are made using flex circuits.
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