Assembly of an optical component and an optical waveguide
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United States of America Patent
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Mar 9, 1999
Issued Date -
N/A
app pub date -
May 8, 1997
filing date -
May 16, 1996
priority date (Note) -
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Abstract
A silicon-on-insulator chip has a location recess formed therein for receiving a laser diode. The location recess includes two non-parallel location surfaces adapted to abut against two reference surfaces formed on the laser diode. The abutment of the location surfaces against the reference surfaces enables a laser emission area of the laser diode to be accurately aligned with a rib waveguide formed on the silicon-on-insulator substrate.
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