Process for producing semiconductor device
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United States of America Patent
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Mar 16, 1999
Grant Date -
N/A
app pub date -
Jan 21, 1997
filing date -
Jan 22, 1996
priority date (Note) -
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Abstract
A process for manufacturing a wafer dicing/bonding sheet of the present invention comprises a soft film, a pressure sensitive adhesive layer formed on the soft film, a processing film for polyimide type resin composed of a heat resistant resin which has been formed on the pressure sensitive adhesive layer and a polyimide adhesive layer formed on the processing film. It is preferred that the processing film be a polyethylene naphthalate film whose surface has been subjected to an alkyd release treatment. The present invention facilitates expansion to be conducted after the wafer dicing.
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