Stack module
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United States of America Patent
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Mar 16, 1999
Grant Date -
N/A
app pub date -
Apr 18, 1997
filing date -
Apr 18, 1996
priority date (Note) -
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status (Latency Note)
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Abstract
A stack module is provided which relieves thermal stress generated in a heat-radiating element and provides improved cooling efficiency. Connection bumps of a plurality of mounting substrates, onto which are mounted semiconductor chips are used to stack the substrates to four levels, three wave-shaped heat-radiating elements, made of copper, being in thermal contact between the semiconductor chips of three of the mounting substrates and the rear surfaces of three of the mounting substrates, making use of the spring elasticity of the heat-radiating elements to establish this thermal contact.
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