Apparatus for conditioning polishing pads
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United States of America Patent
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Mar 23, 1999
Grant Date -
N/A
app pub date -
May 12, 1997
filing date -
May 12, 1997
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A flexible conditioning apparatus and method for uniformly conditioning a polishing surface of a pad used to remove undesirable irregularities from a silicon wafer and to achieve a planar condition of the polishing pad. In a preferred embodiment of the present invention, a roughening member comprising a plurality of point contacts, such as diamond particles, is adapted for movement into and out of engagement with the surface of the pad. A flexible member supporting the roughening member allows the roughening member to conform to the surface of the pad to achieve uniform polishing of the pad.
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